RT KaizenInvestor
I have written a full article on the AI chip supply chain.

The supply chain is structured into 4 different phases with 13 layers:

1. Raw Materials: $SHECY, $SUOPY, GlobalWafers, $WAF.DE, $SHWDF, $AXTI, $IQE
2. Manufacturing Equipment: $ASML, $ASM.AS, $AMAT, $LRCX, $KLAC
3. EDA & Core Intellectual Property: $SNPS, $CDNS, $ARM, $RMBS
4. Chip Design: $NVDA, $AMD, $INTC, $QCOM
5. Foundries: $TSM, Samsung Semiconductor, $SMIC
6. Memory and HBM: SK Hynix, Samsung Electronics, $MU
7. Packaging and OSAT: ASE Technology, $AMKR, JCET Group
8. Server and Rack Integration: $SMCI, $DELL, $HPE, Foxconn
9. Networking Silicon: $AVGO, $MRVL, $CSCO, $ANET
10. Photonics and Optical Components: Ayar Labs, $ALAB, $CRDO, $COHR, $LITE
11. Power, Thermal management and Grid: $VRT, $MOD, $NVT, $SU.PA, $IREN, $CIFR
12. Hyperscalers: $AMZN, $GOOGL, $MSFT, $META
13. AI Storage, platforms and Data: VAST data, Weka, NetAPP, $PLTR, Blue Yonder, $KXSCF

The article covers it all.

KaizenInvestor: http://x.com/i/article/2029218092270628864

THE HBM sector could grow from $4B in 2023 to $130B by 2033 according to Bloomberg.

These companies are set to benefit:

The Big 3:
$MU | Micron
$SSNLF | Samsung
$HXSCL | SK Hynix

Ecosystem:
$ASML | ASML
$TSM | TSMC
$INTC | Intel
$AMD | Advanced Micro Devices
$NVDA | Nvidia

Advanced Equipment Suppliers
$BESI | BE Semiconductor
Hanmi Semiconductor
Disco Corp

Packaging:
$AMKR | Amkor
ASE Technology Holding
JCET Group

Design and IP
$RMBS | Rambus
$CDNS | Cadence Design Systems
$SNPS | Synopsys

Others:
$MRVL | Marvell
Fujitsu
Powertech Technology
$AMAT | Applied Materials
$KLIC | Kulicke and Soffa